阿斯麦CEO:新一代"高数值孔径"技术预计今年晚些时候将首次公布逻辑与存储芯片产品数据

美股速递
May 20

阿斯麦首席执行官透露,备受瞩目的下一代"高数值孔径"光刻技术,有望在今年晚些时候迎来关键里程碑——首批关于逻辑芯片与动态随机存取存储器产品的实际性能数据预计将首次公布。这一进展标志着该尖端技术在半导体制造两大核心领域的同时推进,为行业观察者评估其实际应用潜力提供了重要依据。

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10