异动解读|应用材料盘后上涨3.04%,半导体设备板块集体强势反弹延续叠加机构目标价支撑

行情直击
Jul 31

7月31日,应用材料盘后上涨3.04%,报516.0美元/股,成交额2.76亿美元。

消息面上,此前连续多日遭受大空头迈克尔·伯里做空压力、AI支出回报疑虑及中国光刻机竞争担忧三重夹击后,半导体设备板块出现集体强势反弹。费城半导体指数单日涨超7%,同行业拉姆研究涨超20%,科磊、泰瑞达等纷纷走高,板块联动带动应用材料延续强势。此外,汇丰、花旗、瑞银此前密集上调应用材料目标价至683至705美元区间,分析师平均目标价为641.61美元,当前股价与机构目标价之间仍存在较大折价空间,对股价形成有力支撑。公司将于8月13日公布第三财季业绩,市场预期EPS为3.36美元,财报预期亦构成短期催化。

(以上内容均基于市场公开消息,由程序或算法智能生成,仅作为股价异动提醒,不作为投资建议或交易依据。)

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