当地时间11月29日,日本电装(Denso)与富士电机(Fuji Electric)共同宣布,双方将在碳化硅功率半导体领域展开合作。新闻稿指出,电装与富士电机共同提交的《半导体供应保障计划》已获得日本经济产业省批准。根据该计划,两家公司将在碳化硅(SiC)功率半导体相关的制造领域进行投资和合作,该项目投资额达2116亿日元(约合人民币102亿元)。据悉,在此次合作中,电装旗下大安制作所将制造SiC...
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