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路透社12月4日 - Soitec 将向 GlobalFoundries$(GF)$ 提供用于 GF最新无线电平台的 RF-SOI 晶圆。
这家法国半导体制造商表示，它将为GF的无线电解决方案9SW提供300毫米RF-SOI晶圆，该解决方案将用于制造未来的5G和Wi-Fi芯片。
"Soitec 在一份声明中说："从 5G 向 5G-Advanced 以及最终的 6G 过渡，要求下一代设备具有更高的性能和能效，以及更紧凑的结构。
该公司的客户包括台积电 、联电 、索尼 和意法半导体<STMicroelectronics 。
Soitec 在其上半年财报 (link) 中表示，随着订单从今年第一季度的低水平回升，智能手机市场的反弹提升了其 RF-SOI 晶圆的销量。
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