近日有消息称,现代汽车已解散其“半导体战略室”。据悉,该部门成立于2022年,最初计划负责5nm车载芯片的研发工作。此前,现代汽车曾计划在2029年量产自研的无人驾驶汽车芯片,但随着该部门的解散,这一雄心可能受挫。解散后,原部门职能和人员将并入先进汽车平台(AVP)本部和采购部门;AVP本部由宋昌铉社长领导,负责软件研发。对此,有媒体指出,现代汽车高度依赖Mobileye的ADAS芯片,解散“...
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