汽车巨头,解散半导体部门!

满天芯
26 Dec 2024

韩国现代汽车曾经成立一个专门负责负责研发车载芯片的“半导体战略室”,但在两年后,传该部门在近日解散。据韩媒 ETNews报道,现代汽车(Hyundai)解散了负责研发车载芯片的“半导体战略室”,该部门的职能和人员分别并入先进汽车平台(AVP)本部和采购部门。原半导体战略室室长,来自三星电子的 Jae-Seok Chae 常务,已离职。“半导体战略室”成立于2022 年,当时正值全球汽车芯片短缺的...

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