中晟鲲鹏光电半导体取得一种碳化硅晶圆背面加工工艺专利

金融界
Jan 04, 2025

金融界2025年1月4日消息,国家知识产权局信息显示,中晟鲲鹏光电半导体有限公司取得一项名为“一种碳化硅晶圆背面加工工艺”的专利,授权公告号CN 115472550 B,申请日期为2022年9月。天眼查资料显示,中晟鲲鹏光电半导体有限公司,成立于2022年,位于深圳市,是一家以从事计算机、通信和其他电子设备制造业为主的企业。企业注册资本5000万人民币。通过天眼查大数据分析,中晟鲲鹏光电半导体...

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