苹果M5 Pro和M5 Max芯片预计下半年量产 将采用台积电最新封装技术

TechWeb
08 Feb

【TechWeb】2月8日消息,本周早些时候曾有外媒在报道中提到,苹果多年的A系列和M系列芯片独家代工商台积电,已在采用N3P制程工艺,为他们量产M5芯片,正处在对M5芯片进行封装的早期过程中。在M5芯片开始量产后,苹果这一系列芯片的其他产品,如M5 Pro和M5 Max,也就将提上日程。而在最新的报道中,外媒也提到,苹果M5 Pro和M5 Max芯片,将在今年下半年开始量产,最高端的M5 ...

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