证券之星消息,晶方科技(603005)02月07日在投资者关系平台上答复投资者关心的问题。投资者:请问贵公司“MEMS传感器芯片先进封装测试平台”这个项目进展如何了,有什么技术突破吗晶方科技董秘:您好,该项目为公司牵头承担的国家重点研发计划项目,项目针对高端MEMS传感器先进封装测试需求,建立基于标准的面向图像传感器、硅麦克风、加速度计、陀螺仪、压力传感器、红外传感器、流量传感器等高端传感器的先进...
Source Link证券之星消息,晶方科技(603005)02月07日在投资者关系平台上答复投资者关心的问题。投资者:请问贵公司“MEMS传感器芯片先进封装测试平台”这个项目进展如何了,有什么技术突破吗晶方科技董秘:您好,该项目为公司牵头承担的国家重点研发计划项目,项目针对高端MEMS传感器先进封装测试需求,建立基于标准的面向图像传感器、硅麦克风、加速度计、陀螺仪、压力传感器、红外传感器、流量传感器等高端传感器的先进...
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