黑芝麻智能:国内车规级SOC龙头 软硬件协同发展未来可期

财通证券
19 Feb

国内车规级SoC 龙头,软硬件协同发展未来可期:公司是全球第三大车规级高算力SoC 供应商,推出行业内首个集成汽车多域的跨域SoC,公司软硬件协同发展:硬件方面,主要产品包括专注于自动驾驶应用的华山系列高算力SoC 以及武当系列车规级跨域SoC;软件方面,提供自动驾驶配套软件,以支持客户在SoC 上开发及部署应用程序时进行定制。汽车智能化趋势明确,车规级SoC 芯片市场广阔:据弗若斯特沙利文预测,...

Source Link

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10