英伟达(NVDA)据报包下台积电(TSM)今年超70%的先进封装产能

金吾财讯
Feb 24, 2025

金吾财讯 | 据媒体,业界消息称,英伟达(NVDA)最新Blackwell构架GPU芯片需求强劲,已包下台积电今年超过70%的CoWoS-L先进封装产能,出货量以每季环比增长20%以上逐季冲高。

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