在半导体行业持续创新发展的浪潮中，碳化硅（SiC）和氮化镓（GaN）作为第三代半导体材料的代表，正逐渐成为行业焦点。近期，芯联集成与南京国博电子发布的最新财报，芯联集成在碳化硅（SiC）业务上实现高速增长，营收大幅提升且减亏明显；南京国博电子虽业绩承压，但在氮化镓（GaN）业务方面积极进取，多个芯片产品成功开发并交付，产业化项目技术升级稳步推进。芯联集成：业绩上扬，SiC业务成增长引擎根据芯联集成...
Source Link在半导体行业持续创新发展的浪潮中，碳化硅（SiC）和氮化镓（GaN）作为第三代半导体材料的代表，正逐渐成为行业焦点。近期，芯联集成与南京国博电子发布的最新财报，芯联集成在碳化硅（SiC）业务上实现高速增长，营收大幅提升且减亏明显；南京国博电子虽业绩承压，但在氮化镓（GaN）业务方面积极进取，多个芯片产品成功开发并交付，产业化项目技术升级稳步推进。芯联集成：业绩上扬，SiC业务成增长引擎根据芯联集成...
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