ASMPT:智能制造设备龙头 TCB技术重构封装价值

方正证券
Mar 24, 2025

公司概况:全球领先的电子制造业硬件、软件、服务解决方案供应商。ASMPT成立于1975 年,通过1980 年并购FICO(线机制造)及引线框架电镀公司,完成半导体封测设备领域早期布局。目前公司核心业务分为半导体封装(SEMI)与表面贴装(SMT)两大板块:1)SEMI 业务:聚焦半导体封装设备全链条布局,产品矩阵涵盖固晶/焊线/塑封/切筋成型等系统及整线设备。2)SMT 业务:构建智能制造开放生态...

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