路透4月15日 - 美国计算机芯片设备供应商应用材料公司（Applied Materials AMAT.O）周一表示，该公司已经收购了 BE Semiconductor industries(BESI) BESI.AS公司9%的股份。
这家荷兰半导体先进封装公司生产世界上最精确的混合键合工具，这是一种关键的芯片技术，可以将两个芯片直接键合在一起。
应用材料公司表示，它不打算在 BESI 公司寻求董事会代表。
(为便利非英文母语者，路透将其报导自动化翻译为数种其他语言。由于自动化翻译可能有误，或未能包含所需语境，路透不保证自动化翻译文本的准确性，仅是为了便利读者而提供自动化翻译。对于因为使用自动化翻译功能而造成的任何损害或损失，路透不承担任何责任。)
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