车展速递|黑芝麻智能发布“安全智能底座”,武当芯片预计2025年底达到量产状态

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Apr 23, 2025

在智驾安全成为行业关注点的背景下,黑芝麻智能(2533.HK)在2025年上海国际车展上发布了“安全智能底座”方案。据悉,该方案以武当C1200家族跨域融合芯片为核心,通过硬件级安全隔离架构,实现功能安全域隔离,满足ASIL-D最高安全等级,消除跨域融合系统的数据安全隐患。  在底层技术突破的同时,黑芝麻智能同步推进产业协同创新。展会期间,黑芝麻智能宣布与英特尔达成战略合作,联合推出“舱驾融合平台...

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