BRIEF-Microchip Unveils New High-Density Power Module For AI At The Edge Applications

Reuters
24 Apr
BRIEF-Microchip Unveils New High-Density Power Module For AI At The Edge Applications

April 24 (Reuters) - Microchip Technology Inc MCHP.O:

  • MICROCHIP UNVEILS NEW HIGH-DENSITY POWER MODULE FOR AI AT THE EDGE APPLICATIONS

Source text: ID:nGNXbnx23j

Further company coverage: MCHP.O

((Reuters.Briefs@thomsonreuters.com;))

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