联华电子(联电)在本月公布的年度报告中透露,其最先进的12nm工艺节点开发进展顺利。作为与英特尔合作的关键技术,该工艺在功耗、性能和面积(PPA)三大核心指标上较现有14nm工艺有显著提升。客户反馈显示,联电的12nm技术在行业内具备较强竞争力。根据规划,联电将于2026年完成12nm工艺验证,并计划于2027年正式投入生产。此外,在先进封装领域,联电正积极推进晶圆级3D W2W混合键合解决方案,...
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