快科技4月28日消息,据报道,NVIDIA最新的B300芯片生产进度已提前至5月启动,业界推测这一调整主要是应对H20芯片被禁导致的产能空缺。供应链消息显示,B300芯片将采用台积电的5nm家族制程及CoWoS-L先进封装技术,沿用了Bianca架构,零组件和ODM代工的学习曲线得以延续,有助于加快GB300芯片在今年底进入量产的进程。台积电南科的先进封装AP8已于4月初开始进机,这似乎是为了满足...
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