华虹半导体申请超级结器件的制造方法专利,提升制造效率

金融界
28 Apr

金融界2025年4月28日消息,国家知识产权局信息显示,华虹半导体(无锡)有限公司申请一项名为“超级结器件的制造方法”的专利,公开号CN119894029A,申请日期为2025年1月。专利摘要显示,本申请涉及半导体集成电路制造技术领域,具体涉及一种超级结器件的制造方法。超级结器件的制造方法包括以下步骤:提供半导体基底层,半导体基底层包括芯片区和隔离在芯片区之间的划片槽区,芯片区的半导体基底层中形成...

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