据彭博援引知情人士消息称，索尼集团正考虑将旗下半导体业务Sony Semiconductor Solutions Corp.分拆并上市，借此简化公司结构、聚焦娱乐领域。消息人士指出，最快今年内可能完成分拆计划，索尼拟将大部分半导体业务股份分配给现有股东，并在分拆后保留少数股权。
由于市场因美国总统特朗普关税政策波动剧烈，分拆计划仍在审议中，细节可能有所变动。索尼近年来已宣布计划分拆金融事业群，如今考虑分拆半导体事业，显示公司逐步调整策略、提升企业价值。
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