4月30日消息,英特尔新任CEO陈立武今日在美国加州圣何塞举行的Intel Foundry Direct Connect 2025活动中亮相,概述了公司在晶圆厂代工项目上的进展。陈立武宣布,公司现在正在与即将推出的14A工艺节点(1.4nm等效)的主要客户进行接触,这是18A工艺节点的后续一代。英特尔已有几个客户计划流片14A测试芯片,这些芯片现在配备了公司增强版的背面电源传输技术,称为...
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