4月30日,广合科技(001389.SZ)公告,计划发行H股股票并在香港联交所主板上市。此举旨在深化公司全球战略布局。公司将综合考虑股东利益与资本市场情况,择机完成上市计划。目前正与中介机构商讨相关细节,具体方案尚未最终确定。同时,广合科技宣布董事会决定聘请安永香港为此次发行并上市的审计机构。
资料显示,广合科技一直致力于以高速、高频为主的高端PCB制造,产品主要应用于数据中心、云计算、工业互联网、人工智能、5G通讯、汽车电子、安防和打印等终端领域。
近日,广合科技披露2025年第一季度业绩预告,公司预计归属于上市公司股东的净利润2.2亿元至2.6亿元,同比增长51.63% 至79.20%;扣除非经常性损益后的净利润2.1亿元至2.5亿元,同比增长39.82% 至69.78%。
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