在台积电北美技术研讨会上,台积电表示无需使用High NA(高数值孔径)EUV光刻机来制造其A14 (1.4nm) 工艺的芯片。台积电在研讨会上介绍了A14工艺,并表示预计将于2028年投入生产。此前,台积电曾表示A16工艺将于2026年底问世,而且也不需要使用High NA EUV光刻设备。据悉,台积电业务发展高级副总裁Kevin Zhang表示:“从2nm到A14,我们无需使用High NA,...
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