【芯成推出车规级智慧驾驶SoC设计平台】芯原股份近日宣布其车规级高性能智慧驾驶系统级芯片 (SoC) 设计平台已完成验证,并在客户项目上成功实施。基于芯原的芯片设计平台即服务 (Silicon Platform as a Service, SiPaaS) 业务模式,该平台可为自动驾驶、智能驾驶辅助系统 (ADAS) 等高性能计算需求提供技术支持。

金融界
29 Apr
芯原股份近日宣布其车规级高性能智慧驾驶系统级芯片 (SoC) 设计平台已完成验证,并在客户项目上成功实施。基于芯原的芯片设计平台即服务 (Silicon Platform as a Service, SiPaaS) 业务模式,该平台可为自动驾驶、智能驾驶辅助系统 (ADAS) 等高性能计算需求提供技术支持。

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