在日前英特尔推出了A14工艺之后,两大晶圆厂巨头正式入局这个巅峰之争。从目前的资料看来,总体而言,他们在架构、EUV光刻和晶体管设计上展开了激烈竞争。 首先看台积电,据该公司执行副总裁兼联席首席运营官Yuh-Jier Mii (米玉杰)博士介绍,当前的发展方向是从FinFET到Nanosheet。除了这些技术之外,垂直堆叠的NFET和PFET器件(称为CFET)也可能是实现器件微缩的候选方案。除了...
Source LinkDisclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.