英特尔代工业务落地:18A制程与先进封装是否能成?

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06 May

芝能智芯出品英特尔在加州圣何塞举办的代工业务2025活动中,交流了代工业务的最新进展,聚焦18A制程节点、先进封装技术及生态系统建设。英特尔18A以RibbonFET和PowerVia技术为核心,预计2025年底实现高量产,Panther Lake和Clearwater Forest分别作为客户端和服务器端的首发产品。与此同时,EMIB 2.5D/3.5D和Foveros Direct等先进封装...

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