富士胶片将在印度建设一家半导体材料工厂,为印度政府支持的芯片项目供货,希望借此融入随着高科技生产从中国转移而不断增长的供应链。富士胶片将于今年在印度西部古吉拉特邦购置土地,最早将于2026年开始建设,目标2028年左右投入运营,总投资额将达到数十亿日元。富士胶片正在探索生产用于去除芯片制造过程中杂质的化学品,并希望在该工厂开发解决方案和其他产品。该公司将首先向印度塔塔集团旗下的芯片制造子公司塔塔...
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