上个月的2025英特尔代工大会上,英特尔分享了多代核心制程和先进封装技术的最新进展,其中Intel 18A制程节点已进入风险试产阶段,并将于今年内实现正式量产。同时英特尔还介绍了演进版本Intel 18A-P,与Intel 18A的设计规则兼容,将为更大范围的代工客户带来更卓越的性能,早期试验晶圆目前已经开始生产。另外还有Intel 18A-PT,在Intel 18A-P基础上继续改进,可通过...
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