英特尔EMIB-T技术:更大芯片尺寸下的高密度集成

Ofweek光电信息网
08 May

芝能智芯出品英特尔正以EMIB-T为核心,在先进封装技术领域迈出关键一步,融合了EMIB与TSV两项核心封装手段,不仅支持HBM4和UCIe等高带宽接口,还为Chiplet设计提供高密度互连能力。通过与Cadence、西门子EDA、Synopsys等EDA巨头协作,英特尔正加速构建EMIB-T的设计工具链和生态系统。在Chiplet正逐步走向主流的当下,EMIB-T或将成为支撑下一代高性能异构...

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