台积电研发新型封装技术

新浪财经
May 09

据业界消息, 台积电 正在积极研发一种名为 WMCM 的新型封装技术。从名称缩写推测,该技术全称可能为晶圆(级)多芯片模组。目前,这项技术的研发工作主要在竹南厂进行,龙潭厂也已开始小规模试产,而未来的主要量产任务则将落在嘉义厂第 1 期厂房。据了解,嘉义厂 P1 的 Mini Line 小批量生产线预计将在今年第四季度启动建设。业内人士分析指出, 苹果 公司计划在其 iPhone 18 系列的部分...

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