消息称台积电试产 WMCM 工艺,应对苹果 A20 SoC 封装转型

IT之家
09 May

IT之家 5 月 9 日消息,台媒《MoneyDJ 理财网》今日援引“业界消息”报道称,台积电正积极开发一项名为 WMCM 的封装工艺,从缩写来看该技术的全称预计是晶圆(级)多芯片模组。报道指台积电目前在竹南厂开发 WMCM 封装,龙潭厂也有小量试产,实际量产则将在嘉义厂 P1(第 1 期厂房),嘉义厂 P1 的 Mini Line 小规模量产线的建设将于今年四季度启动。对于 WMCM 封装,业界...

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