【晶合集成：今年将加快40nm、28nm等制程技术应用导入】金十数据5月14日讯，5月14日下午，晶合集成2024年度暨2025年第一季度业绩说明会，公司董事长蔡国智表示，目前行业处于复苏态势，根据半导体市场的细分，今年晶合加快推进OLED、高阶CIS以及PMIC产品的研发、量产，提高OLED、高阶CIS及PMIC产品的营收占比，并同时加快40nm、28nm等制程技术应用导入和车用芯片的研发。
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