聚焦ArF、EUV等高阶技术布局,三星或将低阶光罩制造外包

全球半导体观察
May 14, 2025

韩媒《The Elec》报道,三星计划将用于#存储器芯片制造的光罩(photomask)生产外包。此前,为了防止技术外泄,三星一直自行生产所需的全部光罩,但该公司正评估制造低阶光罩(i-line与KrF)的潜在供应商。报道称,这些供应商包括Tekscend Photomask和PKL,前者是日本Toppan Holdings子公司,后者为美国光罩公司Photronics所拥有。报道称,评估工作正在...

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