台积电张晓强:AI驱动未来先进制程与先进封装需求

爱集微
May 15

5月15日,台积电业务开发、全球业务资深副总经理暨副共同营运长张晓强在台积2025技术论坛中国台湾场次上提到,AI驱动未来5/4/3nm以及更先进制程与先进封装需求,在产业30年来已感受到最近半导体产业正面临非常振奋人心的时刻。张晓强提到,AI驱动未来5/4/3nm以及先进封装,先前在北美技术论坛都说CoWoS走在中国台湾马路上连路人都知道,若有做半导体知识测验相信中国台湾全民都是领先,今天不论...

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