台积电先进技术暨光罩工程副总经理张宗生表示,随着全球AI应用与高性能计算(HPC)需求快速扩张,台积电持续加快制程升级与全球建厂脚步,今年不仅是台积电2nm量产元年,且3nm产能将再大增六成,以迎合客户强劲需求。他并透露,今年预计添加九座厂区,包括八座晶圆厂与一座先进封装厂。台积电供应链透露,受惠台积电持续增加资本支出及宣布在中国台湾、美日德展开全球布局,相关供应链,尤其设备和材料厂如弘塑、辛耘、...
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