联发科首席执行官:我们与台积电关系密切,将使用其CoWoS封装技术用于人工智能专用集成电路芯片。

金融界
20 May
联发科首席执行官:我们与台积电关系密切,将使用其CoWoS封装技术用于人工智能专用集成电路芯片。

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