如今,随着先进制程研发成本激增、量子隧穿效应等物理极限逼近,传统工艺升级的红利日益收窄。在摩尔定律逐渐放缓的当下,半导体行业正从单一依赖制程微缩的路径转向多元化创新。其中,先进封装技术的兴起为芯片性能的进一步优化提供了新的思路。此外,特色工艺的发展更是成为推动半导体产业多元化和差异化竞争的关键力量。不同于追求晶体管密度极致的先进制程(如3nm、2nm),特色工艺以其定制化、多样化制程优化能力,聚焦...
Source Link如今,随着先进制程研发成本激增、量子隧穿效应等物理极限逼近,传统工艺升级的红利日益收窄。在摩尔定律逐渐放缓的当下,半导体行业正从单一依赖制程微缩的路径转向多元化创新。其中,先进封装技术的兴起为芯片性能的进一步优化提供了新的思路。此外,特色工艺的发展更是成为推动半导体产业多元化和差异化竞争的关键力量。不同于追求晶体管密度极致的先进制程(如3nm、2nm),特色工艺以其定制化、多样化制程优化能力,聚焦...
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