新思科技:千亿门级SoC、CPU、FPGA、AI芯片等(最新议程:5.20成都、5.22南京、5.23杭州)!

芯榜
19 May

新思科技硬件加速验证技术日即将登陆成都、南京、杭州在 AI、HPC 和智能汽车产业推动下,全球半导体行业因千亿门级芯片设计复杂、上亿行代码系统验证艰巨而面临考验。新思科技推出新一代硬件加速验证(HAV)解决方案。5 月,新思科技硬件加速验证技术日将在成都、南京、杭州举办,全球专家分享技术与方案,探讨破局策略。成都、南京、杭州

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