近日,全球领先的精密互连解决方案提供商鸿腾精密科技(FIT Hon Teng)宣布,公司正持续深化与美国芯片巨头博通(Broadcom)在共封装光学(CPO)技术领域的战略合作。此次合作将为下一代数据中心基础设施建设提供关键技术支持,推动AI计算进入"光速互连"新时代。作为该计划的关键合作伙伴,鸿腾精密为博通Tomahawk 5(TH5)Bailly平台提供了一系列核心硬件组件,包括先进的无焊接...
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