金融界2025年5月24日消息,国家知识产权局信息显示,英特尔公司申请一项名为“ESD保护电路、半导体芯片、基站和移动设备”的专利,公开号CN120033639A,申请日期为2024年09月。
专利摘要显示,本公开涉及ESD保护电路、半导体芯片、基站和移动设备。ESD保护电路包括:用于耦合到半导体芯片的I/O节点的第一节点;经由至少一个第一二极管耦合到第一节点的第一导电路径,第一导电路径被配置为处于第一电压电平,该第一电压电平高于或等于半导体芯片的第一供电电压的电压电平;经由至少一个第二二极管耦合到第一节点的第二导电路径。第二导电路径被配置为处于第二电压电平,该第二电压电平低于或等于半导体芯片的第二供电电压的电压电平,第二供电电压的电压电平低于第一供电电压的电压电平;第二节点,用于耦合到半导体芯片的接地节点或用以提供所述第二供电电压的半导体芯片的供电节点。
Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.