5月21日,有媒体在英伟达全球媒体问答会上提问称,在先进封装方面,三星与英特尔也很积极发展自家的先进封装技术,因此是否能选择台积电CoWoS以外的方案?对此,英伟达CEO黄仁勋表示,CoWoS是非常先进的技术,“在目前除了CoWoS,我们无法有其他选择”。黄仁勋称,“没有人比我们更努力去推动先进封装的发展。”他表示自家的芯片面积比一般芯片大得多,甚至是两倍大,并利用CoWoS先进封装连结起来。此前...
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