联发科宣布2nm芯片9月流片,性能提升15%,正面对决高通苹果

DeepTech深科技
21 May

芯片设计公司联发科(MediaTek)在近期的台北国际电脑展(Computex Taipei)期间宣布了一项重要进展。公司副董事长兼首席执行官蔡力行在主题演讲中确认,联发科计划于 2025 年 9 月将其首款采用 2nm 制程工艺的芯片产品在台积电(TSMC)完成流片。蔡力行在其演讲中,围绕人工智能等技术趋势,阐述了联发科的布局。其中,2nm 芯片的推进是其技术规划中的一个关键环节。尽管这款 ...

Source Link

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10