如果您希望可以时常见面,欢迎标星收藏哦~来源:内容编译自etnews。三星电子将于2028年将玻璃基板引入半导体制造。玻璃基板是下一代组件,可实现人工智能(AI)芯片等高性能半导体。基于此,三星电子开始为未来的半导体市场做准备。据业内人士25日透露,三星电子已确定计划在2028年将玻璃基板引入先进半导体封装领域,其要点是用“玻璃中介层”取代“硅中介层”,这也是三星电子玻璃基板路线图首次被确认。一位...
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