雷递网 雷建平 5月28日深圳基本半导体股份有限公司（简称：“基本半导体”）日前递交招股书，准备在港交所上市。年营收3亿 亏损2.37亿基本半导体从事碳化硅功率器件的研发与产业化。公司总部位于深圳，在北京、上海、无锡、香港以及日本名古屋设有研发中心和制造基地。基本半导体研发覆盖碳化硅功率半导体的芯片设计、晶圆制造、封装测试、驱动应用等产业链关键环节，核心产品包括碳化硅二极管和MOSFET芯片、汽车...
Source Link雷递网 雷建平 5月28日深圳基本半导体股份有限公司（简称：“基本半导体”）日前递交招股书，准备在港交所上市。年营收3亿 亏损2.37亿基本半导体从事碳化硅功率器件的研发与产业化。公司总部位于深圳，在北京、上海、无锡、香港以及日本名古屋设有研发中心和制造基地。基本半导体研发覆盖碳化硅功率半导体的芯片设计、晶圆制造、封装测试、驱动应用等产业链关键环节，核心产品包括碳化硅二极管和MOSFET芯片、汽车...
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