IT之家5月26日消息，台媒《经济日报》昨晚援引业界消息报道称，美光已同台湾地区集成电路力成封装测试服务厂商力成科技 (Powertech， PTI) 敲定 HBM2 内存的独家封装订单外包协议。
HBM 高带宽内存目前已发展到 HBM3E 量产、HBM4 发布的时间点，但英特尔 Gaudi 3 和小型芯片企业的 AI ASIC 仍在使用价格低廉的 HBM2 (E)，对成熟产品的需求仍然存在。
台湾地区同时是美光 DRAM 内存前后端生产重镇，将 HBM2 的封装委外有助于美光腾出中科先进封装基地的产能空间，全力强攻 HBM3E、HBM4 两大价值更高的新品类。
据悉力成正为承接美光 HBM2 封装订单添购设备，预计今年中左右逐步到位，下半年开始验证生产，年底前将进入小量试产阶段，明年实现大规模量产。这也是该企业首度跨足 HBM 封装市场。
Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.