AI驱动的数字/模拟流程、多芯片集成创新以及广泛的IP产品组合可提供业界领先的性能、功耗和面积(PPA)优势基于Synopsys.ai,为台积公司A16和N2P工艺的数字和模拟设计流程提供了优化的性能和快速的模拟设计迁移针对台积公司A14工艺启动EDA流程开发的早期合作 新 思科 技 广泛的基础和接口IP产品组合针对台积公司N2/N2P工艺实现业界领先的低功耗业界领先的完整IP解决方案支持HBM4...
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