金融界2025年5月28日消息,国家知识产权局信息显示,盛美半导体设备(上海)股份有限公司、盛美半导体设备韩国有限公司、清芯科技有限公司申请一项名为“连接装置、基板热处理单元及涂胶显影设备”的专利,公开号CN120044761A,申请日期为2023年11月。专利摘要显示,本发明公开了一种连接装置、基板热处理单元及涂胶显影设备。上述连接装置用于连接相邻腔体,相邻腔体的相向侧开设有通气孔,且相邻腔体...
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