IBM要杀入先进封装市场

半导体行业观察
28 May

如果您希望可以时常见面,欢迎标星收藏哦~来源:内容编译自marklapedus。IBM 和 Deca Technologies 在半导体封装领域结成了重要联盟,此举将使 IBM 进入先进的扇出型晶圆级封装市场。根据该计划,IBM 预计将在其位于加拿大魁北克省南部城市布罗蒙特 (Bromont) 的现有封装工厂内建立一条新的高产量生产线。未来某个时候,IBM 的新生产线预计将生产基于 Deca 的 ...

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