瑞财经 刘治颖据芯源新材料官网消息,近日,深圳芯源新材料有限公司(以下简称“芯源新材料”)宣布完成C轮融资,由北京小米智造股权投资基金合伙企业(有限合伙)独家投资,备战IPO。本轮增资将重点用于碳化硅模块封装材料的精进研发与产业化布局。芯源新材料成立于2022年,是一家以高导热封装互连材料为核心的科技企业。公司专注于以纳米金属产品为代表的半导体用散热封装材料的研发、生产、销售和技术服务,为功率...
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