ASM申请负载锁定装置及其制造方法和半导体处理系统专利,实现负载锁定装置设计与半导体处理系统构建

金融界
May 31

金融界2025年5月31日消息,国家知识产权局信息显示,ASM IP私人控股有限公司申请一项名为“负载锁定装置及其制造方法和半导体处理系统”的专利,公开号CN120072696A,申请日期为2024年11月。

专利摘要显示,一种负载锁定装置包括负载锁定主体,负载锁定主体具有在上附件座孔处限定上附件座的上板、在中间附件座孔处限定中间附件座的与上板间隔开的中间板以及在下附件座孔处限定下附件座的通过中间板与上板分开的下板。第一附件板固定到上附件座,第二附件板固定到下附件座。上附件座孔、中间附件座孔和下附件座孔竖直对准以形成负载锁定主体孔。还描述了半导体处理系统和制造负载锁定装置的方法。

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